Key elements of thermal field

Temperature range:usually refers to the temperature that can be reached within the furnace(such as 1200℃~3000℃)and the working temperature range.

Uniformity:Thermal field uniformity(such as within±5℃)is crucial for the stability of material processing,especially in fields such as semiconductors and ceramic sintering.

Types of heat sources:resistance heating,induction heating,microwave heating,gas heating,etc.Different heat sources affect the distribution of the thermal field.

Thermal insulation materials,such as ceramic fibers,graphite,refractory bricks,etc.,are used to reduce heat loss and maintain thermal field stability.

Key points of thermal field design

Heating element layout:Improve temperature uniformity by optimizing the arrangement of resistance wires,silicon carbide rods,or graphite rods.

Insulation layer design:Multi layer insulation materials(such as zirconia and mullite)can reduce radial thermal gradients.

Airflow control:For furnace types that require atmosphere protection(such as hydrogen furnaces),airflow circulation affects the uniformity of the thermal field.

Temperature measurement and feedback:Real time monitoring using thermocouples,infrared thermometers,or optical pyrometers,combined with PID algorithm to adjust power.

Application scenarios and thermal field requirements

Crystal growth(such as monocrystalline silicon):requires minimal axial/radial temperature difference(±1℃)to avoid crystal defects.

Powder metallurgy:requires rapid heating and uniform sintering to prevent product deformation.

Heat treatment(quenching,annealing):Control the cooling rate in a specific temperature zone to optimize material properties.

Research experiments may require customized thermal fields(such as local high temperatures,gradient temperatures).