Application Fields

High temperature furnace thermal field components:

Heat shield/reflector:Utilizing high melting point and low thermal expansion coefficient(5.3×10⁻⁶/℃)to reduce thermal deformation.

Sintering tray:used for powder metallurgy below 1600℃to avoid contamination(La₂O∝chemical inertness).

Electronic industry:

Semiconductor heater:High purity molybdenum lanthanum alloy(total impurities<50ppm)is used for single crystal silicon growth.

Electron tube grid:optimized thermal electron emission performance.

Aerospace:

Rocket nozzle lining:Short term resistance to 2000℃gas erosion(requires anti-oxidation coating).

Key points of sheet metal processing technology

Thickness control:

Conventional board:0.1-5mm(surface roughness Ra≤0.8μm).

Ultra thin foil material:0.02~0.1mm(requires multiple passes of rolling and intermediate annealing).

Welding and connection:

Electron beam welding(vacuum environment)or brazing(using Ti Zr Ni brazing material,900℃).

Precautions for use

High temperature limit:

Long term use≤1800℃(≤600℃in oxidizing atmosphere).

Mechanical processing:

Recommended diamond cutting tools(cutting speed 30-50m/min).

Surface treatment:

Nickel plating:improves low-temperature oxidation resistance(400~600℃).

Silicification treatment:Form MoSi₂coating(resistant to oxidation at 1700℃).