The main applications of molybdenum plate

(1)High temperature furnace thermal field components

Heat shield/reflector:reduces thermal deformation by utilizing low thermal expansion coefficient.

Heater bracket/electrode:high temperature resistance and good conductivity.

Crucible/boat:used for crystal growth and powder metallurgy(such as sapphire single crystal furnace).

(2)Electronic industry

Semiconductor equipment:silicon wafer heater,PVD sputtering target material.

Electronic tubes/vacuum devices:gate and anode components.

(3)Aerospace&Nuclear Industry

Rocket nozzle lining:Short term resistance to high temperature gas up to 2000℃.

Nuclear reactor components:resistant to radiation and liquid metal corrosion.

(4)Other industries

Glass melting furnace electrode:replaces traditional graphite electrodes with longer lifespan.

High temperature mold:used for sintering tungsten/molybdenum alloys.

Processing technology of molybdenum plate

(1)Preparation method

Powder metallurgy(mainstream process)

Molybdenum powder pressing→sintering(1800~2200℃/H₂)→hot rolling→cold rolling→annealing

Can produce sheet metal with a thickness of 0.02mm~50mm.

Melting and rolling(high purity requirement)

Electron beam melting(EBM)or arc melting→forging→rolling

(2)Key processing points

Rolling:Hot rolling(1200~1400℃)→Cold rolling(room temperature,can be reduced to 0.05mm foil).

Annealing:Eliminating work hardening and improving ductility(1000~1200℃/H₂).

Cutting:

Laser cutting(precision machining,suitable for thin plates).

Wire cutting(slow wire cutting,high precision,suitable for thick plates).

Welding:

Electron beam welding(vacuum environment,high quality).

Argon arc welding(TIG,requires preheating to prevent cracking).