High temperature furnace thermal field

Contact

Tel: 136-0396-0595

Email: lyxcxcl@163.com

Address: Baiying Village, Xindian Town, High tech Zone, Luoyang City

<< Return

Circular vacuum furnace chamber

The circular vacuum furnace chamber is the core component of vacuum heat treatment equipment, mainly used for precision heat treatment of materials without oxidation or decarburization in high-temperature environments.
Product details

Core functions and advantages

Vacuum environment: Vacuum is applied inside the furnace chamber (usually ≤ 10 ⁻ ³ Pa) to eliminate oxygen and water vapor, prevent material oxidation and decarburization, especially suitable for active metals such as titanium alloys and stainless steel.

Uniform heating: The circular structure facilitates uniform distribution of the thermal field (temperature difference can be controlled within ± 5 ℃), avoiding deformation of the workpiece.

High temperature performance: Made of high-temperature resistant materials such as molybdenum, tungsten, or graphite (up to 2200 ℃), combined with multi-layer insulation design to reduce heat loss.

Typical Structure and Materials

Main material:

Metal type: stainless steel (≤ 1000 ℃), molybdenum (1600 ℃), tantalum (2200 ℃), electrolytic polishing is required to reduce the gas release rate.

Non metallic type: high-purity graphite (treated with anti-oxidation coating), ceramic fiber (rapidly heated).

Multi layer design:

Inner liner: Directly exposed to high temperatures, made of high-purity materials.

Insulation layer: multi-layer molybdenum sheet or graphite felt, reflecting thermal radiation.

Cooling system: External water-cooled jacket (quickly cools down to below 300 ℃).

Key manufacturing processes

Welding technology: argon arc welding or electron beam welding ensures vacuum sealing, with a weld leakage rate of less than 1 × 10 ⁻¹⁰ Pa · m ³/s.

Surface treatment: Inner wall mirror polishing (Ra ≤ 0.4 μ m) reduces gas adsorption.

Supporting structure: ceramic columns or water-cooled electrodes to avoid thermal deformation and conduction.

Application scenarios

Aerospace: Hot isostatic pressing (HIP) treatment of turbine blades.

Semiconductor: Annealing process for silicon wafers (requiring metal contamination<0.1ppm).

Tool steel: Vacuum quenching of molds (hardness HRC60 or higher).