Basic characteristics

　　Physical characteristics:

　　Density:10.2 g/cm³

　　Melting point:2620℃

　　Thermal expansion coefficient:4.8×10⁻⁶/K(20-1000℃)

　　Thermal conductivity:138 W/(m·K)(20℃)

　　Mechanical properties:

　　Tensile strength:500-700 MPa(room temperature)

　　Hardness:200-250 HV

　　Chemical characteristics:

　　Resistant to most acid corrosion(except for hot concentrated sulfuric acid and nitric acid)

　　Easy to oxidize at high temperatures(>400℃requires protective atmosphere)

　　Main application areas

　　1.Semiconductor industry

　　Thermal field components of monocrystalline silicon growth furnace

　　Chemical Vapor Deposition(CVD)Equipment Lining

　　Ion implantation machine components

　　2.High temperature heat treatment

　　Vacuum furnace insulation screen

　　Sintering furnace chamber

　　High temperature experimental apparatus

　　3.Manufacturing of special glass

　　Glass melting electrode protective cover

　　Fiber preform processing mold

　　4.Aerospace

　　Rocket engine nozzle liner

　　High temperature sensor housing

　　Manufacturing process

　　Powder metallurgy method(mainstream process):

　　Molybdenum powder isostatic pressing,high-temperature sintering(2000-2200℃),hot forging/hot rolling processing,precision machining(turning,grinding)

　　Melting processing method(high purity requirement):

　　Electron beam melting,forging and forming,cold rolling forming