Comparison of Core Differences with Circular Hearthstone

Characteristics: Square vacuum chamber, circular vacuum chamber

The structural strength needs to be strengthened with anti deformation design for edges and corners (high stress concentration) and natural pressure bearing structures (uniform stress)

Uniformity of thermal field with larger edge temperature difference (± 8-10 ℃) and more uniform (± 3-5 ℃)

Space utilization rate increased by 30%~50% (suitable for stacking plate-shaped workpieces), with lower effective volume

20%~35% higher manufacturing cost (complex welding process) relatively economical

Key design elements

1. Structural reinforcement plan

Edge processing:

Adopting a circular arc transition design (R angle ≥ 50mm) to reduce the risk of thermal stress cracking

External reinforcement rib layout (e.g. 304 stainless steel frame+integrated water-cooled pipeline)

Sealing system:

Double metal seal (copper gasket+spring energy storage seal) ensures the airtightness of the right angle flange

Dynamic sealing compensation technology (to cope with thermal expansion and contraction deformation)

2. Thermal field optimization technology

Multi zone heating layout:

Side and bottom heaters with independent temperature control (such as molybdenum strip partition winding)

Edge enhanced auxiliary heating belt (compensating for corner heat loss)

Reflective screen design:

Ladder style multi-layer molybdenum screen (layer spacing 5-10mm)

The corners are made of deformable metal felt (to relieve thermal expansion stress)

Typical application scenarios

Photovoltaic industry:

Rapid annealing of silicon PERC cells (temperature control ± 2 ℃ required)

Square furnace chamber matched with silicon wafer transmission track (reducing dead zone space)

Composite material forming:

Carbon fiber prepreg hot pressing tank process (requiring uniform flat pressure)

Electronic component packaging:

Vacuum brazing of IGBT modules (mostly rectangular substrates)