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Tungsten copper plate

Tungsten copper plate is an alloy sheet composed of tungsten (W) and copper (Cu), which combines the excellent properties of both metals and is widely used in high temperature, high pressure, and high conductivity scenarios.
Product details

1、 Composition and Characteristics

Composition range

The copper content in tungsten copper alloys is usually 10%~50%, and specific grades such as CuW50 and CuW70 can be customized by adjusting the tungsten copper ratio.

Tungsten (W): melting point up to 3410 ℃, density 19.25 g/cm ³, providing high strength and high temperature resistance.

Copper (Cu): Excellent electrical and thermal conductivity (conductivity of 59-60 MS/m, thermal conductivity of 401 W/(m · K)), good ductility, and easy processing.

Core Features

High hardness and strength: The bending strength can reach 790-2158 MPa (depending on the grade), suitable for wear-resistant components.

High temperature resistance: The melting point is about 3000 ℃. Copper evaporates and absorbs heat at high temperatures, forming a "metal sweating" effect and reducing surface temperature.

Moderate conductivity and thermal conductivity: conductivity of 54-65% IACS (International Annealed Copper Standard), thermal conductivity of 150-250 W/(m · K), balancing the requirements of high thermal conductivity and structural strength.

Anti arc erosion: An oxide film is formed on the surface under the action of an arc, reducing erosion and extending the service life.

2、 Production process

Main process flow

Mixing, pressing, sintering, and infiltration: Tungsten copper powder is mixed and pressed into shape, and then liquid-phase sintered at 1300-1500 ℃ to form a dense structure.

Process optimization: By adding nickel activation sintering or mechanical alloying, the density (>98%) can be increased, but the conductivity may be reduced.

Quality control

Purity and impurity control: high-purity tungsten powder (impurities<0.5%) and electrolytic copper powder are used to ensure material performance.

Thermal conductivity and electrical conductivity detection: By adjusting the copper content, the thermal conductivity and electrical conductivity are optimized to meet different application requirements.

3、 Application Fields

Electrode material

Used for high hardness material discharge machining (such as electrical discharge machining), with high surface smoothness and low wear.

Contact and switch materials

The arc contacts of high-voltage circuit breakers and vacuum contactors are resistant to arc erosion and suitable for high voltage environments above 500000 V.

Welding and guide materials

Submerged arc welding nozzle, resistance welding electrode, and guiding protective components for wire rolling.

Aerospace and Electronics

Rocket nozzle throat liner, missile tip (resistant to high temperatures of 3000-5000K), and electronic packaging heat dissipation substrate (combining the low expansion of tungsten with the high thermal conductivity of copper).