Main characteristics

High thermal conductivity: The addition of copper significantly enhances thermal conductivity (≈ 180-220 W/m · K), making it suitable for heat dissipation applications.

Low coefficient of thermal expansion (CTE): The CTE of molybdenum (≈ 5.0 × 10 ⁻⁶/K) matches many ceramic and semiconductor materials, reducing thermal stress.

Higher melting point: Although the melting point of molybdenum (2623 ° C) is lower than tungsten, it is still suitable for high-temperature environments (such as vacuum electronic devices).

Good mechanical strength: more resistant to high temperature deformation and arc erosion than pure copper.

Machinability: Molybdenum has a lower hardness than tungsten and is easier to cut, drill, or wire cut.

Typical applications

Electronic packaging:

Heat dissipation substrate (such as power semiconductors, RF devices).

Heat sink materials (laser diodes, microwave tubes).

Aerospace: Rocket nozzle liners, high-temperature structural components.

Military industry: Conductive heat dissipation components for high-power electronic devices.

Industrial molds: Injection or die-casting mold inserts that require rapid cooling.

Comparison of Common Ingredients and Performance

Composition ratio density (g/cm ³) Thermal conductivity (W/m · K) Thermal expansion coefficient (× 10 ⁻⁶/K) Typical applications

Mo60Cu40~9.8 180-200~7.0 electronic packaging

Mo50Cu50~9.3 200-220~8.5 heat dissipation components

Mo30Cu70~8.5 220-250~10.0 high thermal conductivity demand scenario

Note: The higher the molybdenum content, the lower the coefficient of thermal expansion, but the thermal conductivity slightly decreases; The higher the copper content, the stronger the thermal conductivity, but the high-temperature strength decreases.

Preparation process

Powder metallurgy method (mainstream method):

Mixing molybdenum powder with copper powder (or using molybdenum skeleton copper infiltration process).

Compression molding (cold isostatic pressing, compression molding).

High temperature sintering (hydrogen protection, copper liquid-phase sintering).

3D printing: suitable for complex structures, but at a higher cost.