Material characteristics

High thermal conductivity: Copper has excellent thermal conductivity (about 400 W/m · K), which can effectively dissipate heat.

Low expansion coefficient: The thermal expansion coefficient of molybdenum (4.8~5.6 × 10 ⁻⁶/℃) is matched with ceramic and semiconductor materials to reduce thermal stress.

High strength and hardness: Molybdenum provides high mechanical strength (tensile strength can reach over 500 MPa).

Good conductivity: The conductivity of copper (≥ 80% IACS) ensures the efficiency of current transmission.

Adjustable performance: By adjusting the molybdenum/copper ratio (usually 10%~50% Cu), thermal conductivity, strength, and expansion coefficient can be balanced.

Main application areas

Electronic packaging: used as a heat dissipation substrate and power device substrate (such as IGBT, laser diode).

Aerospace: High temperature components, rocket nozzle liners, and other scenarios that require heat shock resistance.

Military equipment: high power density equipment such as missile guidance heads and electromagnetic gun components.

Vacuum devices: electrodes, supports, etc., due to the good stability of molybdenum copper in a vacuum environment.

Common specifications and processing

Size: The thickness is usually 0.5-10 mm, the width can reach 300 mm, and the length can be customized.

Surface treatment: Nickel or gold plating can be used to improve corrosion resistance or welding performance.

Processing technology:

Powder metallurgy: mixing molybdenum copper powder → pressing → sintering → copper infiltration, resulting in a density of over 98%.

Hot/Cold Rolling: Improving the flatness and mechanical properties of sheet metal.

Wire cutting/laser cutting: precision machining of complex shapes.

Advantages and limitations

Advantages:

Lighter than tungsten copper (with a density of about 10 g/cm ³), suitable for weight reduction needs.

Non magnetic, suitable for sensitive electronic environments.

Limitations:

High cost (due to scarce molybdenum resources and complex processes).

Copper is prone to oxidation at high temperatures (>800 ℃) and requires protective atmosphere or coating.