Basic characteristics

Physical characteristics:

Density:10.2 g/cm³

Melting point:2620℃

Thermal expansion coefficient:4.8×10⁻⁶/K(20-1000℃)

Thermal conductivity:138 W/(m·K)(20℃)

Mechanical properties:

Tensile strength:500-700 MPa(room temperature)

Hardness:200-250 HV

Chemical characteristics:

Resistant to most acid corrosion(except for hot concentrated sulfuric acid and nitric acid)

Easy to oxidize at high temperatures(>400℃requires protective atmosphere)

Main application areas

1.Semiconductor industry

Thermal field components of monocrystalline silicon growth furnace

Chemical Vapor Deposition(CVD)Equipment Lining

Ion implantation machine components

2.High temperature heat treatment

Vacuum furnace insulation screen

Sintering furnace chamber

High temperature experimental apparatus

3.Manufacturing of special glass

Glass melting electrode protective cover

Fiber preform processing mold

4.Aerospace

Rocket engine nozzle liner

High temperature sensor housing

Manufacturing process

Powder metallurgy method(mainstream process):

Molybdenum powder isostatic pressing,high-temperature sintering(2000-2200℃),hot forging/hot rolling processing,precision machining(turning,grinding)

Melting processing method(high purity requirement):

Electron beam melting,forging and forming,cold rolling forming