Molybdenum based wafer

　　Molybdenum based platform is a substrate or platform made mainly of molybdenum(Mo),widely used in multiple high-tech fields.

　　Main characteristics

　　High melting point:Molybdenum has a melting point of up to 2623°C,making it suitable for high-temperature applications

　　Good thermal conductivity:excellent thermal conductivity

　　Low thermal expansion coefficient:good dimensional stability

　　High mechanical strength:maintains good strength even at high temperatures

　　Corrosion resistance:Has good corrosion resistance to certain molten metals and glass

　　Main application areas

　　Electronic industry:

　　Power semiconductor device substrate,LED chip carrier,electronic packaging material

　　Photovoltaic industry:

　　Back electrode of CIGS(copper indium gallium selenide)thin film solar cells

　　Glass industry:

　　Glass melting electrodes,glass fiber production components

　　High temperature stove:

　　High temperature heating element support,heat treatment furnace accessories

　　Manufacturing process

　　Molybdenum based wafers are typically manufactured through the following processes:

　　Powder metallurgy pressing,high-temperature sintering,mechanical processing(turning,milling,etc.),surface treatment(polishing,coating,etc.)